Specialized Material for Conductive and Sliding Surfaces
Our Copper Alloy Powder is specifically developed for conductive, thermal, and sliding friction surface applications. The chemical composition follows the Cu-8Sn-2Zn-0.3P formulation, delivering a cladding layer hardness of 120 to 180 HB. This powder is primarily used in electrical contacts, switches, sliding bearing bushings, and guide plates. It provides good electrical conductivity while offering moderate wear resistance. Our powder is produced using water atomization, achieving a spherical ratio above 89%. Although the spherical ratio is slightly lower than our gas-atomized products, our Copper Alloy Powder still offers good feeding adaptability for most cladding systems.

Stable Physical Properties for Consistent Performance
The particle size range of this powder is 40 to 104 micrometers. The oxygen content is controlled below 260 parts per million. The flowability does not exceed 20 seconds per 50 grams, and the apparent density ranges from 4.8 to 5.2 grams per cubic centimeter. Copper alloy powder has high thermal conductivity, which causes rapid heat transfer during cladding. Our process team provides specialized heat input control recommendations to prevent porosity or poor bonding caused by excessive cooling rates. We recommend preheating the workpiece to achieve better bonding quality when cladding copper-based materials onto steel substrates. Our Copper Alloy Powder delivers reliable performance for specialized applications.
Testing Support and Fast Delivery
Our technicians have extensive experience with various copper alloy powder applications. If you need conductivity or friction coefficient testing for the cladding layer, we can assist with testing and provide data reports. Our powder is packaged under vacuum to prevent oxidation and moisture absorption during storage. Standard delivery takes 7 to 15 working days, and we support small-batch orders for process trials. Choose our Copper Alloy Powder for consistent quality in your specialized applications.
Technical Specifications
|
Parameter |
Value |
|
Main Chemical Composition |
Cu-8Sn-2Zn-0.3P |
|
Particle Size Range |
40-104μm |
|
Powder Morphology |
Spherical Rate ≥89% |
|
Oxygen Content |
≤260ppm |
|
Cladding Layer Hardness |
120-180HB |
|
Flowability |
≤20s/50g |
|
Apparent Density |
4.8-5.2 g/cm³ |
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